3M™ Scotch-Weld™ Epoxy Adhesive 2216 is a flexible, two-part epoxy adhesive that cures at room temperature. It provides a high-strength bond with both high shear and peel strength while remaining highly flexible, making it ideal for applications where vibration and thermal expansion and contraction are common. It also withstands very cold temperatures without becoming brittle.Our 3M Scotch-Weld Epoxy Adhesive 2216 is designed for applications where high performance and flexible bonds are required. Its flexibility makes it ideal for applications involving dissimilar surfaces and where differing coefficients of thermal expansion are a consideration. Once fully cured, the epoxy maintains an extremely strong bond under expansion, contraction, and limited movement while also maintaining a good retention of strength over time and after environmental aging. With a 2:3 mix ratio it is a low viscosity epoxy. It flows smoothly for accurate dispensing. Both the base and accelerator are coded in contrasting colours to ensure you know which half of the product you are using. We've designed 3M Scotch-Weld Epoxy Adhesive 2216 to perform under extremely frigid temperatures. Because it can withstand temperatures up to -423F (-252C), it is ideal for cryogenic bonding applications. At room temperature it offers a 90-minute work life to allow for repositioning and adjustments. It will slowly cure over 7 days, but can be heat cured to reduce this to as little as 30 minutes (at 200F/93C.) It has a bonded shear strength that can withstand up to 3,200 psi at 72F (24C).
Details
Industrial Category:
Adhesives, Sealants and Tape
Application:
Bonding , Large Surface Lamination Assembly , Hard Disk Drive Component Assembly , Potting , Encapsulating , Small Joint Assembly , Sealing
Container Size (Imperial):
Design Challenges:
Noise Vibration & Harshness Control NVH
Maximum Operating Temperature (Fahrenheit):
Storage Temperature (Celsius):
Unit of Use - Customary Net Weight:
Unit of Use - Item Quantity:
Unit of Use - Total Unit Quantity:
Viscosity Range (cps) at Room Temperature:
Base: 75,000, Accelerator: 150,000
Other Details
and limited movement while retaining good strength after environmental aging
Can be heat cured to reduce curing times from 7 days to as a little as 30 minutes
Excellent for cryogenic bonding applications or adhering substrates that will be exposed to extreme cold
including metals and masonry
Maintains a strong bond under expansion
making it ideal for potting and applications in the transportation industries
Medium viscosity help minimize running
or migration while also self-leveling
Versatile bonding agent will adhered a wide variety of similar and dissimilar substrates
Very flexible bond is resistant to extreme shock
