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3M™ Adhesive Transfer Tape
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3M™ Adhesive Transfer Tape by 3M

  • Part Number: 7000049243
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Product Overview
The 3M™ Adhesive Transfer Tape 9472FL is a versatile, 5 mil (0.13 mm) transfer tape on a release liner. Featuring 3M™ acrylic adhesive 300LSE , this tape is capable of reliably bonding a wide variety of similar and dissimilar materials such as metals, most plastics, glass, papers, and painted surfaces.This tape is supplied on a film liner ideal for rotary die-cutting applications. It offers good chemical, humidity, and moisture resistance, as well as performance across a wide temperature range (from -40F/-40C to 300F/148C).
Specifications
Details
Industrial Category:
Adhesives, Sealants and Tape
Industrial Subcategory:
Tapes
Industrial Subtype:
Transfer Tape
Adhesive Type:
Acrylic
Application:
Small Joint Assembly , Large Surface Lamination Assembly , Bonding , Gasket Assembly
Color Family:
Transparent
Indoor/Outdoor:
Indoor/Outdoor
Maximum Operating Temperature (Celsius):
149.0 °C
Maximum Operating Temperature (Fahrenheit):
300.0 °F
Minimum Operating Temperature (Celsius):
-40.0 °C
Minimum Operating Temperature (Fahrenheit):
-40.0 °F
Overall Length (Imperial):
180.0 yd
Overall Length (Metric):
164.59 m
Overall Width (Imperial):
54.0 in
Overall Width (Metric):
1372.0 mm
Primary Liner:
PET
Primary Liner Color:
Transparent
Primary Liner Thickness (Imperial):
2.0 mil
Primary Liner Thickness (Metric):
0.05 mm
Product Key:
9472FL
Substrate 1:
Oily
Substrate 2:
Metal
Total Tape Thickness without Liner (Imperial):
5.0 mil
Total Tape Thickness without Liner (Metric):
0.127 mm
Unit of Use - Customary Net Weight:
100.1720
Unit of Use - Item Quantity:
1.0
Unit of Use - Item Unit:
RLS
Unit of Use - Total Unit Quantity:
1.0
Unit of Use - Unit:
RLS
Manufactured By:
3M
Other Details
Adhesive provides excellent holding power and anti-lifting properties
Excellent bond to low surface energy substrates including powder coatings and plastics such as polypropylene (PP)
High adhesion to metals and high surface energy materials
making it suitable for bonding dissimilar substrates
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